Semiconductor Packaging

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

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Бібліографічні деталі
Автори:	Chen, Andrea, Lo, Randy Hsiao-Yu
Формат:	Online
Мова:	Англійська
Опубліковано:	Taylor & Francis 2021
Предмети:	Circuits and Devices Electromagnetics and Microwaves Electronic Packaging ENG MATERIALS ElectricalEngineering SCI-TECH STM array ball compound frame grid lead level molding package wafer thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFC Electronics: circuits and components thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science
Онлайн доступ:	ONIX_20200921_9781439862070_22
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Semiconductor Packaging

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