Imagem da capa

Semiconductor Packaging

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

ver descrição completa

Na minha lista:
Principais autores: Chen, Andrea, Lo, Randy Hsiao-Yu
Formato: Online
Idioma:inglês
Publicado em: Taylor & Francis 2021
Assuntos:
Circuits and Devices
Electromagnetics and Microwaves
Electronic Packaging
ENG
MATERIALS
ElectricalEngineering
SCI-TECH
STM
array
ball
compound
frame
grid
lead
level
molding
package
wafer
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFC Electronics: circuits and components
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science
Acesso em linha:ONIX_20200921_9781439862070_22
Tags: Adicionar Tag
Sem tags, seja o primeiro a adicionar uma tag!
Seja o primeiro a deixar um comentário!
Você deve entrar na sua conta antes

Registros relacionados