Semiconductor Packaging

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

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Главные авторы:	Chen, Andrea, Lo, Randy Hsiao-Yu
Формат:	Online
Язык:	английский
Опубликовано:	Taylor & Francis 2021
Предметы:	Circuits and Devices Electromagnetics and Microwaves Electronic Packaging ENG MATERIALS ElectricalEngineering SCI-TECH STM array ball compound frame grid lead level molding package wafer thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFC Electronics: circuits and components thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science
Online-ссылка:	ONIX_20200921_9781439862070_22
Метки:	Добавить метку Нет меток, Требуется 1-ая метка записи!

Semiconductor Packaging

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