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Semiconductor Packaging

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

詳細記述

保存先:
主要な著者: Chen, Andrea, Lo, Randy Hsiao-Yu
フォーマット: Online
言語:英語
出版事項: Taylor & Francis 2021
主題:
Circuits and Devices
Electromagnetics and Microwaves
Electronic Packaging
ENG
MATERIALS
ElectricalEngineering
SCI-TECH
STM
array
ball
compound
frame
grid
lead
level
molding
package
wafer
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFC Electronics: circuits and components
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science
オンライン･アクセス:ONIX_20200921_9781439862070_22
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