Semiconductor Packaging
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...
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| Autors principals: | , |
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| Format: | Online |
| Idioma: | anglès |
| Publicat: |
Taylor & Francis
2021
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| Matèries: | |
| Accés en línia: | ONIX_20200921_9781439862070_22 |
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| _version_ | 1865100010274684928 |
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| author | Chen, Andrea Lo, Randy Hsiao-Yu |
| author_browse | Chen, Andrea Lo, Randy Hsiao-Yu |
| author_facet | Chen, Andrea Lo, Randy Hsiao-Yu |
| author_sort | Chen, Andrea |
| collection | Directory of Open Access Books |
| description | In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages. |
| format | Online |
| id | doab-20.500.12854ir-38988 |
| institution | Directory of Open Access Books |
| language | eng |
| publishDate | 2021 |
| publishDateRange | 2021 |
| publishDateSort | 2021 |
| publisher | Taylor & Francis |
| publisherStr | Taylor & Francis |
| record_format | ojs |
| spelling | doab-20.500.12854ir-389882025-03-24T05:50:13Z Semiconductor Packaging Chen, Andrea Lo, Randy Hsiao-Yu Circuits and Devices Electromagnetics and Microwaves Electronic Packaging ENG MATERIALS ElectricalEngineering SCI-TECH STM array ball compound frame grid lead level molding package wafer thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFC Electronics: circuits and components thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages. 2021-02-10T15:00:40Z 2021-02-10T15:00:40Z 2020-09-21T13:34:11Z 2012 book ONIX_20200921_9781439862070_22 OCN: 756484227 https://library.oapen.org/handle/20.500.12657/41662 https://directory.doabooks.org/handle/20.500.12854/38988 eng open access image/jpeg image/jpeg image/jpeg n/a n/a n/a https://library.oapen.org/bitstream/20.500.12657/41662/1/9781439862070.pdf https://library.oapen.org/bitstream/20.500.12657/41662/1/9781439862070.pdf https://library.oapen.org/bitstream/20.500.12657/41662/1/9781439862070.pdf Taylor & Francis CRC Press 10.1201/b11260 10.1201/b11260 fa69b019-f4ee-4979-8d42-c6b6c476b5f0 CRC Press 216 open access |
| spellingShingle | Circuits and Devices Electromagnetics and Microwaves Electronic Packaging ENG MATERIALS ElectricalEngineering SCI-TECH STM array ball compound frame grid lead level molding package wafer thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFC Electronics: circuits and components thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science Chen, Andrea Lo, Randy Hsiao-Yu Semiconductor Packaging |
| title | Semiconductor Packaging |
| title_full | Semiconductor Packaging |
| title_fullStr | Semiconductor Packaging |
| title_full_unstemmed | Semiconductor Packaging |
| title_short | Semiconductor Packaging |
| title_sort | semiconductor packaging |
| topic | Circuits and Devices Electromagnetics and Microwaves Electronic Packaging ENG MATERIALS ElectricalEngineering SCI-TECH STM array ball compound frame grid lead level molding package wafer thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFC Electronics: circuits and components thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science |
| topic_facet | Circuits and Devices Electromagnetics and Microwaves Electronic Packaging ENG MATERIALS ElectricalEngineering SCI-TECH STM array ball compound frame grid lead level molding package wafer thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFC Electronics: circuits and components thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science |
| url | ONIX_20200921_9781439862070_22 |
| work_keys_str_mv | AT chenandrea semiconductorpackaging AT lorandyhsiaoyu semiconductorpackaging |