תמונות העטיפה

Semiconductor Packaging

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

תיאור מלא

שמור ב:
Main Authors: Chen, Andrea, Lo, Randy Hsiao-Yu
פורמט: Online
שפה:אנגלית
יצא לאור: Taylor & Francis 2021
נושאים:
Circuits and Devices
Electromagnetics and Microwaves
Electronic Packaging
ENG
MATERIALS
ElectricalEngineering
SCI-TECH
STM
array
ball
compound
frame
grid
lead
level
molding
package
wafer
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFC Electronics: circuits and components
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science
גישה מקוונת:ONIX_20200921_9781439862070_22
תגים: הוספת תג
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פריטים דומים: Semiconductor Packaging

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