खोज परिणाम - Chen, Andrea
- प्रदर्शित 1 - 1 परिणाम 1
-
Semiconductor Packaging द्वारा Chen, Andrea, Lo, Randy Hsiao-Yu
प्रकाशित 2021पूर्ण पाठ प्राप्त करें
Online
खोज साधन:
संबंधित विषय
Circuits and Devices
ENG
ElectricalEngineering
Electromagnetics and Microwaves
Electronic Packaging
MATERIALS
SCI-TECH
STM
array
ball
compound
frame
grid
lead
level
molding
package
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFC Electronics: circuits and components
wafer