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Semiconductor Packaging per Chen, Andrea, Lo, Randy Hsiao-Yu
Publicat 2021Obtenir text complet
Online
Eines de cerca:
Matèries relacionades
Circuits and Devices
ENG
ElectricalEngineering
Electromagnetics and Microwaves
Electronic Packaging
MATERIALS
SCI-TECH
STM
array
ball
compound
frame
grid
lead
level
molding
package
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFC Electronics: circuits and components
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